Aqueous chemical and low-level radioactive effluents have been disposed to seepage ponds since 1952 at the Idaho National Engineering Laboratory. The solutions percolate toward the Snake River Plain aquifer (135 m below) through interlayered basalts and unconsolidated sediments and an extensive zone of ground water perched on a sedimentary layer about 40 m beneath the ponds. A three-segment numerical model was developed to simulate the system, including effects of convection, hydrodynamic dispersion, radioactive decay, and adsorption. The first segment uses an analytical solution to simulate transport from the ponds to the 25-m thick perched-water lens, assuming steady vertical flow through a 15-m long saturated homogeneous column. The second segment simulates two-dimensional horizontal transport in the perched-water body using finite-difference methods, assuming complete vertical mixing with vertical leakage from the bottom. The third segment of the model simulates vertical solute transport from the perched-water body toward the aquifer, by assuming unsaturated but steady water flow in a series of contiguous, nonhomogeneous independent vertical columns. The transport equation is solved by a "hop-scotch" finite-difference scheme for each column.
Simulated hydraulics and solute migration patterns for all segments agree adequately with the available field data. The model can be used to project subsurface distributions of waste solutes under a variety of assumed conditions for the future. Although chloride and tritium reached the aquifer several years ago, the model analysis suggests that the more easily sorbed solutes, such as cesium-137 and strontium-90, would not reach the aquifer in detectable concentrations within 150 years for the conditions assumed. However, a change in chemistry or hydraulic conditions could increase the mobility of adsorbed waste solutes. Such changes might result from changes in waste disposal practices and effluent chemistry, flooding from the Big Lost River, or future irrigation activity.
